The Karl Suss MA6 is a top and bottom side mask aligner used for fine lithography down to 1 micron and better. The MA6 is ideal for use with i-line (365 nm) and g-line (436 nm) resists. It is capable of processing both 4” wafers, 6” wafers, and chips/pieces. After reading this manual, the user should be able to describe a typical ksaligner process for both top and backside …
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Mask size: 2.5”x 2.5”, 4”x 4”, 5”x 5” and 8”x 8”. Wafer size for Top-Side Alignment: up to 6” in diameter (small samples, 2”,3”,4”. and 6”). Wafer size for Bottom-Side Alignment: 3” and 4”chucksore. Maximum wafer thickness: 3mm. The machine is exclusively intended for use as an alignment and/or exposure.
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Description. The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6’’ in diameter. It uses 5” …
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Karl Suss MA56 Mask Aligner. Fitted for (4″) four inch wafers using a 350W Exposure unit. Utilities Required: Vacuum, Compressed Air, Nitrogen, Power (1.1kW) Hg, Exposure Optics & Vacuum Contact Tooling intact. Dimensions; 46 W x 42 D x 58 H approximately 1200 Pounds.
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Suss Microtech PA200 semiautomatic prober Dark chamber. Motorized microscope mount with 50mm (2") XY travel and pneumatic lift. Mitutoyo FS-60 microscope with Plan APO 2/10/20/50x objectives. DC servo driven wafer stage with linear encoders. Rigid platten with vacuum manifold. Temperature controlled 200mm vacuum wafer chuck
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Dimensions: 6 × 6 × 6 in: Location: G2L2 B53: Tested: Sold AS IS. As Described: Cosmetic Condition: 4 - Excellent: Product Condition: Used: Container: Box: …
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Karl Suss: Model : PH150 : Description : Micropositioner w/ Micrometer Actuators : Base Type : Vacuum: Other Information : More detailed information in extended description. Extended Description : Details at Karl Suss PH150 Micro Positioner.pdf: Exterior Dimensions : Width : 1.500 in (3.8 cm) Depth : 4.750 in (12.1 cm) Height : 4.250 in (10.8 cm) Weight : 1 lb (0 kg)
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SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS MicroTec designs their mask aligner systems for lithography applications in the field of 3D packaging, advanced packaging, MEMS, LED, compound semiconductors, power devices, photovoltaic, nanotechnology and ...
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Karl Suss: Model : PH150 : Description : Micropositioner w/Fine Screw Adjustment : Base Type : Vacuum: Other Information : More detailed information in extended description. Extended Description : Details at Karl Suss PH150 Micro Positioner.pdf: Exterior Dimensions : Width : 1.500 in (3.8 cm) Depth : 4.750 in (12.1 cm) Height : 4.250 in (10.8 cm) Weight : 1 lb (0 kg)
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Karl Suss. Search Inventory: ... Corporation • ESC • EVG • Faith • Filmetrics • Fisher Scientific • Flanders • Fortrend Engineering • Four Dimensions • Fusion • Gasonic • Glen • Gordon • GOW-MAC • Harig • Headway • Hepa Filters • Hitachi • HP • HP/Agilent • …
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Dimensions: 48 × 40 × 30 in: Location: D3L2: Tested: Sold AS IS. As Described: Cosmetic Condition: 3 - Good: Product Condition: Used: Container: Self: OEM Name: Karl Suss: OEM SKU: PSM6 11500018
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Specifications. Part No: 1000. Sensor Part No: 10013995, 405nm. Sale Details. Item Condition: Used Working, 90 Day Warranty. Estimated Packed Shipping Dimensions: L x W x H = 14"x14"x14" @ 12 lbs. Only items pictured are included: If a part is not pictured, or mentioned above, then it is not included in the sale.
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The Karl Suss SB6 bonder is capable of silicon fusion, anodic, and eutectic bonding. There are two separate heads; one for anodic bonding, and another for fusion bonding. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for ...
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The Karl Suss MABA6 Contact Printer’s use a physical master mask that comes into contact with the substrate during exposure. The master can be used multiple times with best resolution about 1.0 µm, and overlay accuracy of 0.5 µm. The Gen 2 model runs in a more manual mode and has SCIL Imprint capability and the Gen 4 model is a newer version with more automation …
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Suss MicroTec MA8/BA8 Mask Aligner Gen3. 2-8” capable. BSA capable. 200-240V. 50/60Hz. Stereo optics w/ objectives. MplanFl N 5x/0.15. Mplan N 10x/0.25. LMPlanFl N 20x/0.40. Dimensions: 54In x 40in x 70in H. In excellent working condition. We can provide installation in USA, Europe and China
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Karl Suss Mask Aligner The SUSS MJB 3 Mask Aligner is used in photolithographic processes to transfer a pattern from a mask to a photoresist coating on the substrate with high resolution. It suitable for handling wafers up to 3 inches in diameter and can be used for other samples with dimensions not exceeding 3 inches in any direction.
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Karl Suss HR-100 Scriber Scribing Procedure. Position the scribe location: For the first scribe with the microscope reticle crosshair. For subsequent scribes with the wafer stage x-axis micrometer. Position the wafer so that the scribe tool tip, when lowered, will be just off of and in front of (towards the operator) the wafer.
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Feb 18, 2022 . File Type PDF Karl Suss Contact Aligner Operation The University Of Held in Sao Paulo, Brazil, from September 6 - September 9, 2010, the mission of the 25th Symposium on Microelectronics Technology and Devices ¿ SBMicro2010 was to share ideas and to point to new directions for future research and development.
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The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6’’ in diameter. It uses 5” masks System and it can be operated manually.
The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike.
By providing access to a professional staff with deep knowledge of fabrication techniques and process development, the UCLA NanoLab enables a broad range of academic and industrial R&D projects.
Karl Suss MA6 Mask Aligner Standard Operating Procedure Tool owner: Roman Akhmechet [email protected], x 8‐0468 Backup: David Barth [email protected]