Karl Suss Spec

Listing Results Karl Suss Spec

About 20 results and 4 answers.

Karl Suss MA6 Mask Aligner INRF

Technical Specifications. Specifications: Substrate size 2” x 2” – 6” x 6” Mask size up to 7” x 7” standard; Exposure Optics: Wave length UV 400; L-Line and G-Line; Exposure source at 350 watt

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SPEC Equipment > Our Products > Buy Refurbished Karl Suss

Suss MicroTec / Karl Suss SPEC Equipment specializes in Suss MicroTec / Karl Suss photolithography systems. We calibrate, repair, refurbish and rebuild numerous Suss MicroTec models to meet original manufacturer’s specifications. Our fully refurbished photolithography tools provide guaranteed performance with huge savings.

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Karl Suss MA8 - SPEC Equipment

Karl Suss MA8. Description: The SUSS MA8 is the system solution for lithography in R & D on substrate sizes up to 200 mm. Widely employed in development and pilot production of IC backend processes, the MA8 also provides full laboratory mask aligner versatility and flexibility. The compatibility of the exposure modes allows processes to be developed on the MA8 which …

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SPEC Equipment > Our Products > Buy Refurbished Karl Suss

Manufacturer: Suss MicroTec / Karl Suss Description: The Karl Suss MA 56 is a mask alignment and exposure system that has highly ecnomonical production capabilities for wafers up to 125mm. It's easy to maintain and can be easily adapted to fit your particular process requirements.

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SPEC Equipment Karl Suss MA6 Mask Aligner / Exposure System

Specifications: For wafers from 2" to 6" or substrates from 3" x 3" up to 6"6" Fiber optics tube: 2 arm (length 2400mm) with statistically mixed fibers for uniform illumination; Objective axis distance: 40-140mm; Objective 5X Olympus UMPL FL 5x - working distance 20mm; Objective 10X Olympus UMPL FL 10x - Working distance 10.1mm

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Karl Suss Aligner - Integrated Microfabrication Lab

Equipment Specifications Operating Procedure The Karl Suss Mask Aligner is the newest addition to our photolithographic machines. It has touch screen controls that allow for parameters to be changed simply and efficiently. It is equipped with a Hitachi monitor for easy to view mask and wafer alignment.

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Karl Suss Printer – Cleanroom Research Laboratory

May 15, 2008 . This level of performance checks involves verification of a full lithography process that assures that a user would receive spec performance from the standard process flow. The tool evaluation will be a part of a full lithography process involving mask making, and exposure of the pattern onto a wafer via the Karl Suss contact printer and then ...

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SPEC Equipment Karl Suss MA56 Mask Aligner Exposure System

The Karl Suss MA 56 is a mask alignment and exposure system that has highly ecnomonical production capabilities for wafers up to 125mm. It's easy to maintain and can be easily adapted to fit your particular process requirements. Features: KSM Split field microscope; Motorized XYZ Stage; Specifications: System capable of 3" to 5" Cassette to ...

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Mask Aligner SUSS MicroTec

MA300 Gen2 Mask Aligner Highly Automated Platform for 300mm and 200mm Wafers MA200 Gen3 Mask Aligner Alignment and Exposure for a Multitude of Applications MA100/150e Gen2 Mask Aligner Automated Platform for Wafers up to 100mm or 150mm Semi-Automated Mask Aligner MA12 Mask Aligner Semi-automated mask aligner for wafer sizes of up to 12"/300 mm

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Suss Aligners - UCSB Nanofab Wiki

Detailed Specifications. Wafer size: 3" max. for vacuum mode; 4” for soft contact (3” x 3” exposure area) Substrate size: 3" x 3" max. Wafer / substrate thickness: 0-4.5 mm; Exposure optics: Standard unit (Aligner #1): 350-450 nm/200 W mercury lamp; IR unit: 280-450 nm/200 W mercury lamp (can filter to 350 nm)

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Karl Suss Wafer Bonder Stanford

Karl Suss Wafer Bonder (ksbonder) Cleanliness: Clean. Processing Technique(s) Bonding; Capabilities and Specifications. Process Temperature Range: Lab Facility, Location, and Badger Information. Lab Organization: Stanford Nanofabrication Facility Cleanroom (SNF Cleanroom) Location: SNF Cleanroom Paul G Allen L107 .

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Karl Suss MA150e Mask Aligner - ClassOne Equipment

SKU: 4561 Categories: Equipment, Mask Aligners & Bonders, Process Equipment. DETAILS: Karl Suss MA150 Mask Aligner consisting of: - Model: MA-150e. - Topside Alignment (TSA) - Automatic Mask Aligner. - Cassette to cassette operation. - Can be used in either Automatic or Manual Mode. - AL3000 Automatic Alignment.

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Wafer Bonder - UCSB Nanofab Wiki

This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to …

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Karl Suss MA-6 Contact Aligner 1 Stanford

The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low vacuum contact; proximity is not available. Our current configuration accommodates 3", 4" and 6" wafers and pieces.

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Karl Suss MA200 Mask Aligner - S/N 270 ClassOne Equipment

SKU: 2463 Categories: As-Is Process Equipment, Equipment, Mask Aligners & Bonders, Process Equipment. DETAILS: Karl Suss MA200 MASK ALIGNER consisting of: - Model: MA200CC. - Automatic Mask Aligner. - Configured for Top Side Alignment. - Cassette to Cassette Operation. - Up to 8"/200mm wafer capable. - Large Clear Field Proximity Maskholder for 9" corner masks, …

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Contact Aligner - UCSB Nanofab Wiki

Mar 01, 2022 . The bond alignment is performed with special fixturing to allow aligned samples to be transferred to the Karl-Suss SB6 system - contact the supervisor beforehand so the bond alignment fixturing can be installed. Detailed Specifications 350 W Hg arc lamp, broadband exposure with Suss UV400 Optics (350 - 450 nm) Resolution (per Manufacturer*):

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Karl Suss iEi PAC-106GW-R21 Computer Suss ACS200 Coater

Specifications. Part#: PAC-106W/ACE-716A. Description: Karl Suss ICP Electronics PAC-106W/ACE-716A Computer. System removed from: Suss ACS200 Coater.

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Frequently Asked Questions

  • What is the Karl Suss mask aligner?

    The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6’’ in diameter. It uses 5” masks System and it can be operated manually.

  • Why choose SUSS MicroTec mask aligners?

    The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike.

  • What is a mask aligner?

    Mask Aligner 1 Highest precision for applications with thick and thin resists. The SUSS MicroTec Mask Aligner has become synonymous... 2 Automated Mask Aligner. 3 Semi-Automated Mask Aligner. 4 Manual Mask Aligner. A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity”... More ...

  • Why choose SUSS MicroTec for imprint lithography?

    SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as required by many imprint applications.

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