Description The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to …
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Karl Suss Aligner General Information Equipment Specifications Operating Procedure The Karl Suss Mask Aligner is the newest addition to our photolithographic machines. It has touch screen controls that allow for parameters to be changed simply and efficiently. It is equipped with a Hitachi monitor for easy to view mask and wafer alignment.
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Karl Suss MA8. Description: The SUSS MA8 is the system solution for lithography in R & D on substrate sizes up to 200 mm. Widely employed in development and pilot production of IC backend processes, the MA8 also provides full laboratory mask aligner versatility and flexibility. The compatibility of the exposure modes allows processes to be developed on the MA8 which …
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Karl Suss MA150 Mask Aligner consisting of: - Model: MA-150e - Topside Alignment (TSA) - Automatic Mask Aligner - Cassette to cassette operation - Can be used in either Automatic or Manual Mode - AL3000 Automatic Alignment - Cognex 8100 Pattern Recognition Software for automatic alignment of the mask to substrate patterns.
ID #: 4561
Max Wafer: 150mm
Manufacturer: Suss
Model: MA150e Mask Aligner
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The Karl Suss MA 56 is a mask alignment and exposure system that has highly ecnomonical production capabilities for wafers up to 125mm. It's easy to maintain and can be easily adapted to fit your particular process requirements. Features: KSM Split field microscope; Motorized XYZ Stage; Specifications: System capable of 3" to 5" Cassette to ...
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The Karl Suss SB6 bonder is capable of silicon fusion, anodic, and eutectic bonding. There are two separate heads; one for anodic bonding, and another for fusion bonding. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for ...
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This auction is for a used Suss MicroTec/Karl Suss RA 120M Automatic Wafer Scriber SUSS MicroTec/ Karl Suss RA120M Includes: Wafer size: 4"100mm; RA120M Controller; RA120M Monitor; Two independent scribing axes(programmed separately) Parameters can be entered as either microns or mils; All parameters are entered via keypad; Display message prompts the …
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Overview The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low vacuum contact; proximity is not available. Our current configuration accommodates 3", 4" and 6" wafers and pieces.
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Higher resolution optic systems that can be supplied by Suss are given below. The standard soft and hard contact modes of mechanical and pneumatic pressure respectively, give resolution to ~1 micron. Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square.
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Dealer Owner. Specification: We are offering for sale a Karl Suss MA6 Mask Aligner. This system was manufactured in 2000 and is in EXCELLENT full operational condition. It is sold as a full and complete system consisting of: Model MA6 Mask Aligner: - …
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Overview The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low vacuum contact; proximity is not available. Our current configuration accommodates 3", 4" and 6" wafers and pieces.
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Karl Suss MA200 MASK ALIGNER consisting of: - Model: MA200CC. - Automatic Mask Aligner. - Configured for Top Side Alignment. - Cassette to Cassette Operation. - Up to 8"/200mm wafer capable. - Large Clear Field Proximity Maskholder for 9" corner masks, with 8" exposure area. - Vacuum Chuck: 8" Thermal Proximity Chuck.
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This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to …
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Karl Suss MA45 ALIGNER MANUAL OPERATION SPLIT FEILD OPTICS 350 WATT LAMP UP TO 4X4" SUBSTRATES or 4" WAFERS TABLE TOP SYSTEM MASK ALIGNER FOR THIN FILM AND HYBRID APPLICATIONS. WAFERS UP TO 4.5"X5" AREA.
Bond Aligner Karl Suss model BA 6 TYPE 105497 NR 315 Good condition- was removed from a working facility. TYPE 105497- s/n: RC 2339. The Karl Suss MA/BA6 can be used in two modes: mask align (MA6) for lithography and bond align (BA6) for wafer-to-wafer alignment followed by clamping or prebonding.
The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6’’ in diameter. It uses 5” masks System and it can be operated manually.
Karl Suss 6 Inch Manual Submicron Analytical Probe Station. Inventory# 58300*Before purchasing this system. Please note that the refurbishment process does not begin until the equipment has been purchased. Please contact us for lead-time. Manual Submicron Analytical Probe Station.
The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6’’ in diameter. It uses 5” masks System and it can be operated manually.
The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike.
Mask Aligner 1 Highest precision for applications with thick and thin resists. The SUSS MicroTec Mask Aligner has become synonymous... 2 Automated Mask Aligner. 3 Semi-Automated Mask Aligner. 4 Manual Mask Aligner. A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity”... More ...
SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as required by many imprint applications.