Detailed Specifications
Wafer size: 3" max. for vacuum mode; 4” for soft contact (3” x 3” exposure area)
Substrate size: 3" x 3" max.
Wafer / substrate thickness: 0-4.5 mm
Standard unit (Aligner
1): 350-450 nm/200 W mercury lamp
±3% over 2" diameter
±5% over 3" diameter
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Objective Lens: 5x, 10x, 20x. Monitor: Hitachi split, left or right screen, left and right focus, grab image button, brightness adjustment. Joystick Control: Continuous step or single step down to 1 micron, mask and/or microscope …
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CT62 Karl Suss CT62 Programmable Process Controller from Karl Suss | Buy Today from Artisan. Fast Quotes & Shipping. Work with our experts to sustain your critical applications. Downloadable Technical Manuals and Datasheets. View It Live with InstraView
Condition: Used and in Excellent Condition
Model: CT62
Manufacturer: Karl Suss
Product Family: RC Series, RC33,RC22, RC16, RC13, RC8, RC5
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Version:1.0. Page | 2. OVERVIEW: UV broadband (250nm-450nm), I-line (365nm) and G-line (436nm) wavelength. available. Contact super-use for installing I-line or G-line filters. Exposure methods: flood, proximity, soft and hard contacts, low vacuum and. vacuum contacts. Mask size: 2.5”x 2.5”, 4”x 4”, 5”x 5” and 8”x 8”.
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Karl Suss MA8. Description: The SUSS MA8 is the system solution for lithography in R & D on substrate sizes up to 200 mm. Widely employed in development and pilot production of IC backend processes, the MA8 also provides full laboratory mask aligner versatility and flexibility. The compatibility of the exposure modes allows processes to be developed on the MA8 which …
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The Karl Suss MA 56 is a mask alignment and exposure system that has highly ecnomonical production capabilities for wafers up to 125mm. It's easy to maintain and can be easily adapted to fit your particular process requirements. Features: KSM Split field microscope; Motorized XYZ Stage; Specifications: System capable of 3" to 5" Cassette to ...
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4561. Manufacturer: Suss. Model: MA150e Mask Aligner. Max Wafer: 150mm. Configuration: Automatic, Topside Alignment, 6"/150mm wafers, Cassette …
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Detailed Specifications Wafer size: 3" max. for vacuum mode; 4” for soft contact (3” x 3” exposure area) Substrate size: 3" x 3" max. Wafer / substrate thickness: 0-4.5 mm Exposure optics: Standard unit (Aligner #1): 350-450 nm/200 W mercury lamp IR unit: 280-450 nm/200 W mercury lamp (can... ...
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Coupled with SUSS MicroTec‘s DirectAlign® accuracies down to 0.25μm can be achieved. Auto Alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention. Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series
Karl Suss
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Detailed Specifications Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity Upper and lower heating of samples 5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen Sample size: pieces to 6” wafers, aligned bonding by using MA/BA-6 aligner Anodic bonding to 2000 V ...
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The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low vacuum contact; proximity is not available. Our current configuration accommodates 3", 4" and 6" wafers and pieces. SNF has two MA-6 aligners (karlsuss and karlsuss2).
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Dealer Owner. Specification: We are offering for sale a Karl Suss MA6 Mask Aligner. This system was manufactured in 2000 and is in EXCELLENT full operational condition. It is sold as a full and complete system consisting of: Model MA6 Mask Aligner: - …
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Dealer Owner. Specification: Hypervision Visionary 2000 Emission Microscope System with a Karl Suss PA-200 1-8" Semiautomatic Probe System. Everything looks complete and everything appears in great condition. I was able to power up the Karl Suss prober and the motors worked on the x and y stage and I was able to focus with the controls and rotate the chuck.
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The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in hard- and soft- contact, as well as high and low vacuum contact; proximity is not available. Our current configuration accommodates 3", 4" and 6" wafers and pieces. SNF has two MA-6 aligners (karlsuss and karlsuss2).
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Karl Suss MicroTec Model 1000 UV Intensity Meter 10013995 405nm Used Working Inventory # 16024 This Karl Suss MicroTec Model 1000 UV Intensity Meter is used working surplus. The physical condition is good, but there are signs of previous use and handling. Specifications Part No: 1000 Sensor Part No: 10013995, 405nm Sal
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Karl Suss MA200 MASK ALIGNER consisting of: - Model: MA200CC. - Automatic Mask Aligner. - Configured for Top Side Alignment. - Cassette to Cassette Operation. - Up to 8"/200mm wafer capable. - Large Clear Field Proximity Maskholder for 9" corner masks, with 8" exposure area. - Vacuum Chuck: 8" Thermal Proximity Chuck.
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SPECIFICATIONS VIEW LIVE Features: 1000 to 7000 RPM Maxium Speed Model Dependent 10 RPM Minimum Step Speed Display via LED Indicators (3 Digits / 7 Segments) The Karl Suss RC Series Spin Coaters are designed and develped using a modular concept which makes them multi-purpose tools adapted to various technical requirements.
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The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike.
The SUSS MJB3 UV400 is equipped with 350W mercury short-arc lamp providing primary exposure wavelengths of 350-450nm. The machines equipped with a high precision stage allowing alignment accuracies to 0.25 microns.
The MJB3 mask aligner offers exceptional flexibility in the processing of irregular shaped samples of different thickness such as sample wafer pieces and glass slides up to standard size 2” diameter wafers. The SUSS MJB3 UV400 is equipped with 350W mercury short-arc lamp providing primary exposure wavelengths of 350-450nm.
Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec.